lululemon outlet a Comprehensive Solution for S

a Comprehensive Solution for Semiconductor Package Thermal Characterization and Design

SEMI THERM, Santa Clara, Calif., February 24, 2010 Corporation (NASDAQ: MENT) today announced the FloTHERM IC productivity tool targeting the semiconductor industry for thermal characterization and design. Addressing increased complexity, chip density, and high speed requirements for today silicon designs, the FloTHERM IC solution is deployed as a unique web based platform that delivers a high level of automation to the design tasks associated with full spectrum thermal characterization and validation.

A typical semiconductor thermal team spends approximately 60 percent of its time on standard package thermal characterization and design, and the remaining time for customer specific characterizations. The FloTHERM IC tool dramatically reduces the time spent on thermal characterization and design by providing an automated process that includes pre verified thermal models to reduce the risk of modeling errors. The tool can also achieve reductions of up to 25 percent in the time usually needed for customer specific characterizations.

The FloTHERM IC tool is based on proven technologies: the industry leading FloTHERM computational fluid dynamics (CFD) software, used to simulate airflow, temperature and heat transfer in electronic systems, and the FloTHERM PACK Smart Parts modeling tool. This new solution addresses the following essential areas of a semiconductor package thermal characterization and design:

Full spectrum thermal metric and compact model generation with full adherence to published JEDEC standards. parametric design for analysis EDA tool interfacing for detailed modeling of BGA substrates for physical layout Data mining of simulation data to enable optimized design time and reuse “Within our organization, our teams all need access to thermal information at different stages of the design and manufacturing cycle. My group has an extensive background in using FloTHERM for electronics cooling applications; however, not everyone needs access to the full power of FloTHERM. That is why FloTHERM IC can fulfill an important role in the design process,” stated Dr. Claudio Maria Villa, Thermal Design, Corporate Packaging and Automation Group, STMicroelectronics. “FloTHERM IC intuitive interface makes it convenient for experts and non experts to access the technology online, quickly build a model from the libraries and test their performance, thereby freeing thermal experts to focus on solving difficult semiconductor packaging the lululemon outlet rmal problems and mission critical issues instead of fulfilling routine requests.”

The product wizard based user interface is simple to use, designed for both the core thermal team and field engineers. Supported fully by an intuitive and flexible library and database infrastructure, the software enables a complete range of JEDEC thermal metrics and compact models to be generated easily and efficiently.

recognize the importance of thermal analysis for today semiconductor packaging market, and we believe our FloTHERM IC solution will be a competitive advantage for our customers, stated Dr. Erich Buergel, general manager o lululemon outlet f Mechanical Analysis Division. ease of use and the ability to perform critical analyses quickly will provide tremendous ROI for our semiconductor customers who are concerned with market delivery and cost constraints. New Technology Featured at SEMI THERM 2010

FloTHERM IC technology will be showcased at SEMI THERM 2010 at the Santa Clara Convention Center, February 21 25, 2010. Additional technical information about the product will be provided during the vendor presentation which will take place on February 23 at 2:00 PM in Ballroom E. Stop by the booth 202 for additional information. Established in lululemon outlet 1981, the company reported rev lululemon outlet enues over the last 12 months of about $800 million and employs approximately 4,425 people worldwide. Boeckman Road, Wilsonville, Oregon 97070 7777.


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